LCM-

Tape-Automated-Bonding(TAB), of course, can reduce the size of LCD module and increase the productivity. However, Chip-On-Glass(COG) goes further!!!
Module using COG Vs TAB
1. Thinner* and More Compacted LCD Module : IC package can be eliminated
2. Lighter LCD module : minimized part contents
3. More competitive price : lower material cost
*Generally, COG LCD module is as thin as LCD panel.

1.BEZEL 2.LCD 3.ZEBRA 4.PCB 5.Backlight


sample	sample

1. Bare die direct attachment to PCB
2. Multiple chips can be bonded on the same board for compact system
3. Flexible design for connection
4. Suitable for low to medium pin count IC (<200 pins)

The COB #I. LCD module

The COB #II. LCD module

TAB is the answer to the most pronounced packaging demand from contemporary electronic industry. With TAB, extremely light weight and compact products become possible. TAB is useful for high pin count devices, especially for LCD drivers. It offers excellent reliability, manufacturing ease and high throughput. Moreover, TAB can be directly connected to the LCD glass panel which enables tremendous size miniaturization.

LCD Drivers in TAB are applied directly to the LCD glass using Anisotropic Conductive Films (ACF) or indirectly using Heat Seal Connectors (HSC). Heat seal connectors offer the capability to bond the TAB to the glass inspite of differences in connector pitch or spacing. Whereas with ACF Connector alignment effort is reduced.

‧TAB APPLICATION WITH HEAT SEAL CONNECTOR


(1) ITO ELECTRODE TERMINAL	(2)HEAT SEAL CONNECTOR BONDING TO LCD	(3)ALIGMENT WITH TAB CONNECTIONS	(4) THERMAL COMPRESSION ATTACHMENT

			TAB application example with HSC


(1)ITO ELECTRODE TERMINAL	(2)ANISOTROPIC EPOXY WITH SERARATOR	(3) PEEL OFF THE SEPARATOR	(4)ALIGMENT WITH TAB CONNECTIONS	(5)THERMAL COMPRESSION ATTACHMENT

				TAB application example with ACF

1.	Auto ACF Bonder: A machine which bonds the ACF to the LCD glass at one ACF strip for each TAB.
2.	LCD Glass Handler: A machine which automatically feeds and handles the LCD glass onto the TAB bonder.
3.	TAB Exciser: Handles the TAB (reel to reel), excises and loads the TAB onto the TAB bonder.
4.	Heat Seal Bonder: Does both the temporary and permanent bonding of the TAB to the LCD glass.
5.	PWB Bonder: Does the automatic bonding of TAB by hot bar solder to the PWB.

	A Complete modular assembly line comprising of several machines which are integrated together to form one complete assembly line.

1. ACF applied

2. TCP prepress

3. Thermo-compression bonding

4. Soldering


	Applies ACF on LCD glass panelby thermal pressing Aligns the LCD panel and TCP patterns and temporarily connects them by low temperature and low pressure Thermocompresses multiple TCPs to the LCD panel, which have been temporarily connected, by high temperature and high pressure either individually or all together Joins output leads of TCPs and PCB patterns by soldering.

Chip-On-Glass Applications
Datavision dedicates to provide state-of-the-art LCD driver chips for
Portable Display Market - Pager, Cellular Phone and PHS.
Now, we also provide GOLD-BUMP Dice to support COG applications !

IC designs have already considered the critical feature for COG applications

Slim Die size and layout - minimise LCD's contact ledge as well as overall module size

1. Au bump slim die direct attachment to glass using ACF
2. Best fit for mobile communication products that require very small and thin LCD module
3. Integrated features on chip to minimize external components
4. Suitable for high pin count IC (>200 pins) with fine pad pitch

1.	Direct connection to glass using ACF or indirect connection using heat seal cable
2.	Compact and light weight COF design optimized for handheld products
3.	Bendable for flexible design
4.	Final tested before shipment for promising manufacturing yield.
5.	Suitable for high pin count IC (>200 pins) with fine pad pitch

High-definition clear color images without a backlight and color filter
This Reflective STN Color LCD is based on a newly developed electrically controlled birefringence (ECB*) technology that delivers a high-brightness, high- definition display with low power consumption while eliminating the need for a backlight and color filter. It is capable of delivering a true black display more sharply defined than previously possible, and this new color LCD display achieves crisp, clear reproduction of both text and images.

1. A single pixel allows a continuous color display of white, black, blue, green and red:
The unit offers a true black display that makes it possible to deliver crisp and clear presentations of both text and images.

2. Bright background colors:
New phase differential plate, a new liquid crystal material system, as well as reflector with high reflectivity, make it possible to attain bright, vivid background colors.

3. Low power consumption:
Like the standard-type STN LCD unit, the ECB-method STN color LCD unit eliminates the need for a backlight and thus reduces the power consumption level.

* Electrically Controlled Birefringence (ECB) Changing the voltage applied to the liquid crystal layer modifies the tilt of the liquid crystal molecules. The resulting change in birefringence of the liquid crystal layer is detected by the two polarizers. This system is used for color displays.
Screen size: 3.4 inches
Resolution: 160 x 240 dots
Colors on display: Five colors: green, red, white, black, blue
Display contrast: 7:1
Response speed: 500 ms

1. VGA:
Offered in standard PCs with 640 x 480 pixel resolution for displaying PC-generated images.
2. SVGA:
With 800 x 600 pixel resolution, PC-generated images are displayed with a display capacity 1.6 times larger than VGA specifications.
3. XGA:
1024 x 768 pixel resolution for displaying images with a display capacity 2.6 times larger than VGA specifications.

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